JPS6258536B2 - - Google Patents
Info
- Publication number
- JPS6258536B2 JPS6258536B2 JP9386880A JP9386880A JPS6258536B2 JP S6258536 B2 JPS6258536 B2 JP S6258536B2 JP 9386880 A JP9386880 A JP 9386880A JP 9386880 A JP9386880 A JP 9386880A JP S6258536 B2 JPS6258536 B2 JP S6258536B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- temperature
- solder
- semiconductor element
- back surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 238000010438 heat treatment Methods 0.000 claims abstract description 30
- 229910000679 solder Inorganic materials 0.000 claims abstract description 22
- 239000004065 semiconductor Substances 0.000 claims description 46
- 238000005476 soldering Methods 0.000 claims description 3
- 238000013021 overheating Methods 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 abstract description 2
- 238000002844 melting Methods 0.000 abstract description 2
- 230000008018 melting Effects 0.000 abstract description 2
- 238000009529 body temperature measurement Methods 0.000 abstract 1
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 5
- 239000000155 melt Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/7525—Means for applying energy, e.g. heating means
- H01L2224/75251—Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/757—Means for aligning
- H01L2224/75743—Suction holding means
- H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
- H01L2224/75981—Apparatus chuck
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/7999—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto for disconnecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/98—Methods for disconnecting semiconductor or solid-state bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9386880A JPS5720441A (en) | 1980-07-11 | 1980-07-11 | Exchanging device for semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9386880A JPS5720441A (en) | 1980-07-11 | 1980-07-11 | Exchanging device for semiconductor element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5720441A JPS5720441A (en) | 1982-02-02 |
| JPS6258536B2 true JPS6258536B2 (en]) | 1987-12-07 |
Family
ID=14094422
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9386880A Granted JPS5720441A (en) | 1980-07-11 | 1980-07-11 | Exchanging device for semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5720441A (en]) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6417439A (en) * | 1987-07-10 | 1989-01-20 | Fujitsu Ltd | Device for removing test board |
| FR2746214B1 (fr) * | 1996-03-15 | 1998-04-24 | Procede et machine d'hybridation par refusion | |
| US7288472B2 (en) * | 2004-12-21 | 2007-10-30 | Intel Corporation | Method and system for performing die attach using a flame |
| JP5251456B2 (ja) * | 2008-11-27 | 2013-07-31 | 株式会社デンソー | 半田付け用真空加熱装置 |
-
1980
- 1980-07-11 JP JP9386880A patent/JPS5720441A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5720441A (en) | 1982-02-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0530248B2 (en]) | ||
| JPS6258536B2 (en]) | ||
| KR100497483B1 (ko) | 정착장치의 가열롤러 및 그 가열롤러의 전극제조방법 | |
| JP2583142B2 (ja) | 熱電モジュールの製造方法 | |
| JPH0646617Y2 (ja) | 電気半田ごて | |
| JPS6228069A (ja) | レ−ザはんだ付け方法 | |
| JPS59134580A (ja) | 電気的導線を接触させる方法 | |
| JP2585661Y2 (ja) | 電気半田ごて | |
| JPH09206932A (ja) | コンスタントヒート熱源を用いた半田接合装置 | |
| JPS6034814B2 (ja) | 半導体素子の取外し方法および装置 | |
| JPS6222278B2 (en]) | ||
| US7824111B2 (en) | Optical module | |
| JPS62227Y2 (en]) | ||
| JP3127407B2 (ja) | 熱圧着方法 | |
| JPH09206931A (ja) | コンスタントヒート式ヒーター装置およびこのヒーター装置を用いた半田接合方法 | |
| JPH11307918A (ja) | ボンディング装置 | |
| JPH03159813A (ja) | パターン間接続法 | |
| JPH08264929A (ja) | バンプ溶融接続構造 | |
| JPH0215974B2 (en]) | ||
| JPH09206930A (ja) | コンスタントヒート式ヒーター装置 | |
| JPH0538835A (ja) | サーマルプリントヘツド製造方法 | |
| JPH11111786A (ja) | ボンディングツール | |
| JPS6159000B2 (en]) | ||
| JPH11320088A (ja) | パルスヒータのヘッド | |
| JP2519635B2 (ja) | 陽極接合方法 |